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| Transistors 2SB0767 (2SB767) Silicon PNP epitaxial planar type Unit: mm For low-frequency output amplification Complementary to 2SD0875 (2SD875) s Features * Large collector power dissipation PC * High collector to emitter voltage VCEO * Mini type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine packing 4.50.1 1.60.2 1.50.1 4.0+0.25 -0.20 2.50.1 3 1.0+0.1 -0.2 1 0.40.08 1.50.1 3 3 2 0.50.08 0.40.04 45 s Absolute Maximum Ratings Ta = 25C Parameter Collector to base voltage Collector to emitter voltage Emitter to base voltage Peak collector current Collector current Collector power dissipation Junction temperature Storage temperature * 3.00.15 Symbol VCBO VCEO VEBO ICP IC PC Tj Tstg Rating -80 -80 -5 -1 - 0.5 1 150 -55 to +150 Unit V V V A A W C C 1 : Base 2 : Collector 3 : Emitter MiniP3-F1 Package Marking symbol C Note) *: Printed circuit board: Copper foil area of 1 cm2 or more, and the board thickness of 1.7 mm for the collector portion s Electrical Characteristics Ta = 25C Parameter Collector cutoff current Collector to base voltage Collector to emitter voltage Emitter to base voltage Forward current transfer ratio *1 Collector to emitter saturation voltage *1 Base to emitter saturation voltage Transition frequency Collector output capacitance Note) *1: Pulse measurement *2: hFE Rank classification Rank hFE1 Marking symbol Q 90 to 155 CQ R 130 to 220 CR Note) The part number in the parenthesis shows conventional part number. Publication date: August 2002 SJC00052BED *1 Symbol ICBO VCBO VCEO VEBO hFE1 *2 hFE2 VCE(sat) VBE(sat) fT Cob Conditions VCB = -20 V, IE = 0 IC = -10 A, IE = 0 IC = -100 A, IB = 0 IE = -10 A, IC = 0 VCE = -10 V, IC = -150 mA VCE = -5 V, IC = -500 mA IC = -300 mA, IB = -30 mA IC = -300 mA, IB = -30 mA VCB = -10 V, IE = 50 mA, f = 200 MHz VCB = -10 V, IE = 0, f = 1 MHz Min -80 -80 -5 90 50 Typ Max - 0.1 Unit A V V V 220 100 - 0.2 - 0.85 120 20 30 - 0.4 -1.2 V V MHz pF 0.4 max. 2.60.1 1 2SB0767 PC Ta 1.4 Printed circut board: Copper foil area of 1 cm2 or more, and the board thickness of 1.7 mm for the collector portion. IC VCE Collector to emitter saturation voltage VCE(sat) (V) -1.2 Ta = 25C IB = -10 mA -9 mA -8 mA -7 mA -6 mA -5 mA -4 mA -3 mA -2 mA -1 mA -10 -3 -1 VCE(sat) IC IC / IB = 10 Collector power dissipation PC (W) 1.2 1.0 0.8 0.6 0.4 0.2 0 -1.0 Collector current IC (A) - 0.8 - 0.3 - 0.1 - 0.03 - 0.01 25C Ta = 75C - 0.6 -25C - 0.4 - 0.2 - 0.003 - 0.001 -1 -3 -10 -30 -100 -300 -1 000 0 40 80 120 160 0 0 -2 -4 -6 -8 -10 Ambient temperature Ta (C) Collector to emitter voltage VCE (V) Collector current IC (mA) VBE(sat) IC Base to emitter saturation voltage VBE(sat) (V) -100 -30 -10 -3 -1 Ta = -25C 75C IC / IB = 10 300 hFE IC VCE = -10 V 200 fT IE VCB = -10 V Ta = 25C Forward current transfer ratio hFE Transition frequency fT (MHz) -100 -300 -1000 250 Ta = 75C 25C 150 -25C 100 160 200 25C 120 - 0.3 - 0.1 - 0.03 - 0.01 -1 -3 -10 -30 -100 -300 -1 000 80 50 40 0 -1 -3 -10 -30 0 1 3 10 30 100 Collector current IC (mA) Collector current IC (mA) Emitter current IE (mA) Cob VCB 50 Area of safe operation (ASO) IE = 0 f = 1 MHz Ta = 25C -10 -3 Single pulse Ta = 25C ICP IC t = 10 ms Collector output capacitance Cob (pF) 40 Collector current IC (A) -1 - 0.3 - 0.1 30 t=1s 20 - 0.03 - 0.01 10 - 0.003 0 -1 -3 -10 -30 -100 - 0.001 - 0.1 - 0.3 -1 -3 -10 -30 -100 Collector to base voltage VCB (V) Collector to emitter voltage VCE (V) 2 SJC00052BED Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL |
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